UNCOOLED THERMAL IMAGING MODULES
• Adopting High-Quality Image Algorithm, no fear of smoke and darkness, providing rich details
• Accurate and fast temperature measurement function
• Leading programmable structure, flexible architecture, rich functions, and strong customization
• Excellent SWaP performance, ultra-small size, ultra-low power consumption, and ultra-light weight
• Manufactured by highly skilled engineers from Lithuania
MC3 model
Thermal Imaging Module
Dimensions 26 x 26mm (without lens)
Weight 21g (without lens and expansion board)
Resolution 640
Frame Rate 25 / 50 Hz
Lens 9 / 13 / 19 / 25 / 35 mm
Shutterless Yes
Expansion board Type-C / MIPI / LVDS etc option
Ultra-low latency
Native CVBS analog video output (PAL / NTSC) option
Enhanced shock and vibration resistance
Ceramic-packaged detector provides enhanced resistance to high-g mechanical loads and vibration compared with conventional WPL packaged sensors
BM18 model
Thermal Imaging Module
Dimensions 18 x 18mm (without lens)
Weight 4.8g (without lens and expansion board)
Resolution 384
Frame Rate 25 / 50 Hz
Lens 2.88 / 5.3 / 9 / 19 mm
Shutterless Yes
Expansion board Type-C / MIPI / LVDS option
Ultra-low latency
Native CVBS analog video output (PAL / NTSC) option
TL2 model
Thermal Imaging Module
Dimensions 21 x 21mm (without lens)
Weight 9g (without lens and expansion board)
Resolution 640/384/256
Frame Rate 25 / 50 Hz
Lens 9 / 13.5 / 18 / 25 / 35 / 55 mm
Shutterless Yes
Expansion board Type-C / MIPI / LVDS option
Ultra-low latency
Native CVBS analog video output (PAL / NTSC) option
AI EO/IR modules
Customization
Shutterless Yes
Ultra-low latency (MIPI)
Enhanced shock and vibration resistance
Ceramic-packaged detector provides enhanced resistance to high-g mechanical loads and vibration compared with conventional WPL packaged sensors
